Description
1.1 This specification details the generic criteria requirements of high pure titanium sputtering targets used as thin film material for through-silicon vias (TSV) metallization in advance packaging.
Product Details
- Published:
- 05/01/2016
- Number of Pages:
- 5
- File Size:
- 1 file , 110 KB
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
