IEC 60191-6-17 Ed. 1.0 b:2011 Digital PDF

$140.00

Mechanical standardization of semiconductor devices – Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for stacked packages – Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
standard by International Electrotechnical Commission, 01/27/2011

Document Format: PDF