IEC 60191-6-18 Ed. 1.0 b:2010 Digital PDF

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Mechanical standardization of semiconductor devices – Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for ball grid array (BGA)
standard by International Electrotechnical Commission, 01/07/2010

Document Format: PDF

Description

IEC 60191-6-18:2010 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger.

Product Details

Edition:
1.0
Published:
01/07/2010
Number of Pages:
40
File Size:
1 file , 1.1 MB
Note:
This product is unavailable in Ukraine, Russia, Belarus