Description
IEC 60749-42:2014 provides a test method to evaluate the endurance of semiconductor devices used in high temperature and high humidity environments. This test method is used to evaluate the endurance against corrosion of the metallic interconnection of chips of semiconductor devices contained in plastic moulded and other types of packages. It is also used as a means of accelerating the leakage phenomena due to the moisture penetration through the passivation film and as a pre-conditioning for various kinds of tests.
Product Details
- Edition:
- 1.0
- Published:
- 08/12/2014
- Number of Pages:
- 16
- File Size:
- 1 file , 350 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
