Description
Provides guidance on reliability stress screening techniques and procedures for electronic components. Is intended for use of a) component manufacturers as a guideline, b) component users as a guideline to negotiate with component manufacturers on stress screening requirements or plan a stress screening process in house due to reliability requirements, c) subcontractors who provide stress screening as a service.
Product Details
- Edition:
- 1.0
- Published:
- 11/27/1998
- Number of Pages:
- 69
- File Size:
- 1 file , 460 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
