Description
Describes the procedure to monitor changes in attenuation and/or return loss of a component or an interconnecting device, when subjected to an environmental or mechanical test. The procedure may be applied to measurements on single samples or to simultaneous measurements on multiple samples, both at single wavelengths and multiple wavelengths, by using branching devices and/or switches as appropriate.
Product Details
- Edition:
- 2.0
- Published:
- 02/20/2003
- Number of Pages:
- 37
- File Size:
- 1 file , 520 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
