IEC 63251 Ed. 1.0 b:2023 Digital PDF

$114.00

Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
standard by International Electrotechnical Commission, 11/01/2023

Document Format: PDF

Description

This International Standard defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this document is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this document specifies a test method to inspect the occurrence of colour exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress.

Product Details

Edition:
1.0
Published:
11/01/2023
ISBN(s):
9782832277508
Number of Pages:
46
File Size:
1 file , 4.7 MB
Note:
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